近年来，随着高端电子产品移动电话，小型电子设备，车载设备，通讯基站，医疗设备向轻薄/微型化，高功能/高性能化发展，如何能更有效地散发所产生的热量成了当前的一大课题。

B&C通过发挥多年的导热材料开发经验积累及团队协作，成功开发了拥有高导热性的InS铟金属导热垫片，同时也是为了北川精密成为领先的先进材料创新型企业，新型导热界面材料项目之一

InS是超薄型导热界面材料热传导率高达86W/m-k ，该材料还具有极佳的延展性可以极大改善接触热阻，在实用化时实现了随客户开发产品的高密度化，随热源的形状灵活应对，按需要订制形状！

InS高级导热界面材料采用专有技术通过功能材料的复合，为设计应用提供卓越的低热阻热管理解决方案。只要选择合适的InS高级导热界面材料产品，可以优化您当前的散热器系统，降低散热系统成本，或有可能减少传统金属散热器比重，使得最终产品变得更轻更高效。

InSthermal pads 优点及特性

•极高导热率86W/m.k•极佳的延展性•接触热阻极低•形状可按需要订制

InSthermal pad是由Indium金属加工成的高档导热界面材料在长期使用时性能优异。由于InS产品是用金属做成的，在循环通电的情况下也不会出现材料渗出的问题。导热弹性材料不含硅胶，在长期使用时，能够适应表面不相同的情况，因而在导热界面材料的使用期内都能降低热阻。由于InS材料呈固态，也能够承受烘烤。

InSthermal pads 应用

• LEDs

• Laser Diodes

• Burn-in

• TIM1, TIM2, and TIM1.5 for ICs

• IGBT power modules

• Power amplifiers

InSthermal pad 被设计应用在IGBT,RF/PA（PowerAmplifier功率放大器），

TIM1,TIM2, 高功率高亮度LED，各种激光器的散热等方面。

InSthermal pads 包装存储

InS高级导热界面材料要储存在工厂提供的容器中紧固密封，存放在相对湿度为 55% 或更低，温度低于22°C的环境中。也可以储存在惰性气体中，例如氮气。

B&C is the leader in metal thermal interface materials (TIMs). All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials. Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. It's ductility and thermal conductivity make it ideal as a compressible thermal interface material. For the thermal K values of other thermally conductive materials, check out our thermal K list.

Metal TIMs can be divided into two categories:

Solder TIMs that reflow and melt to form a mechanical bond

Compressible TIMs that serve as gap fillers and do not need heat to form a bond

Solder interconnects can also act as a thermal interface. B&C makes over 200 different alloys for solder preforms. These alloys can be pure indium, indium alloys, Pb-free, or Pb-contained. Please consult one of our technical support engineers to identify the best metal TIM for your application. Solder TIMs include:

Solder Preforms

Flux-Coated Preforms

Compressible (or non-reflow) TIMs include:

Ins®

Liquid Metal

B&C's metal TIMs can be used in the following applications:

Solder Materials used for Die-Attach

Re-usable Compressible TIMs for Burn-in and Test

Solder Materials and Thermal Materials for IGBT Power Devices

Solder Materials and Thermal Materials for RF Type Devices

Solder for TIM1, TIM2 and TIM1.5 in Microprocessors

Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. We developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi.

An thermal pad made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow. Our thermal conductive technology will further reduce the thermal resistance.

Indium's line of high-end thermal interface materials delivers superior performance over time. As TIM products are made of metal, they cannot experience pump out problems even under power cycling. The Ins material, which does not contain silicone, will conform to surface disparities over time, thereby reducing thermal resistance through the life of the TIM. Due to its solid state, the Ins also resists bake out.

深圳市北川力合科技有限公司

INS铟金属高性能导热界面材料