Features and Beneﬁts

•Fill large gaps while providing superior thermal transfer

•No curing with high reliability

•Working well on the irregular structure gap

•Resistant to high strength

•Excellent mechanical property and weather resistance

Speciﬁcation

Gel 6500 is a thermally conductive, form-in-place, liquid gap ﬁllingmaterial.Gel 6500 possesses excellent structural applicability and ultraconforming property, as well as ﬁlls the gaps fully, for components such asa heat sink, uneven ceramic or irregular cavity.

Gel 6500 is resistant to high voltage and has good thermostability, whichallows its safety and reliabilty.

Gel 6500 ﬂows under pressure like grease and will not cure as aresult ofthermal cycling.

Typical Applications

•Communication Equipment

•Network Terminal

•Storage Device

•LED

•Consumer Electronics

•Power Components

•Security Equipment

深圳市北川力合科技有限公司

GEL6500